Engineering Application Notes
Deep technical analyses, specifications, and layout guidelines for advanced EMI shielding challenges in hardware and RF engineering.
engineering
Conducted Emissions Containment with PCB-Level Shield Cans: A CISPR 25 Design Guide
Engineering guide for PCB shield can selection, footprint design, and conducted emissions mitigation to meet CISPR 25 Class 5 limits in automotive modules.
March 24, 202610 min read
engineeringPCB-Level EMI Shielding: Shield Can Design, Via Stitching, and Grounding Strategies for RF Compliance
Engineering guide covering shield can selection, via stitching pitch rules, ground plane continuity, and reflow soldering profiles for CISPR 25 and IEC 61000-4-3 compliance.
March 24, 202610 min read
engineeringPCB Shield Can Design for Power Supply EMI Filtering Compliance
Engineering guide to integrating board-level shield cans with power supply EMI filter stages for CISPR 32, CISPR 25, and MIL-STD-461 radiated emission compliance.
March 24, 202611 min read