The Component Signal · Issue #5
The Supply Signal #005 — Glut to Constraint: The 2025 Oversupply Is Officially Over
Standard passives, connectors, and MLCCs have flipped from oversupply to allocation. The metal-feedstock repricing behind shield-cost inflation, and the Q3 buying window.
By Mike Kwak, Director · POCONS USA · How we report
Supply Chain Alert: Standard Components Flip From Glut to Constraint
The 18-month component glut that defined 2024–2025 has ended. Distribution price letters now show 5–15% increases across standard catalog products, and lead times that were sitting at book-and-ship are extending across MLCCs, connectors, and discrete passives. The clearest signal: Murata and a leading Korean MLCC maker implemented double-digit MLCC price hikes effective April 1, with Yageo confirming it will follow — and automotive-grade MLCCs are now on allocation.
This is a demand-side inflection, not a supply failure. AI infrastructure, automotive electrification, and a refresh cycle in industrial equipment have all inflected simultaneously. Foundry utilization is running above 95%, and capacitor makers re-loaded automotive grades first, leaving commercial grades short.
For shield procurement, the MLCC squeeze matters twice. First, capacitor placement density drives board-level EMI behavior — fewer decoupling caps or substitutions change the noise profile your shield has to contain. Second, the same commodity inflation hitting passives is hitting shield feedstock. Coordinate them: a shield redesign and a decoupling-network change should be reviewed together, not in separate ECOs.
The Q3 buying window is open now and closing fast. Place orders for allocation-risk passives (automotive MLCCs, high-cap-value ceramics) before the next round of maker price letters. Build a 60–90 day buffer on anything single-sourced.
Price Watch
Older issues quoted these metals per pound at 2025 levels — copper near $4.12/lb, tin near $14.85/lb. Those numbers are obsolete. At today's LME levels, tin has effectively risen ~58% and copper ~47% versus those figures. Re-cost every plated or alloy-content part.
Quick Hits
- Tariffs: 25% US tariff on Korean electronics live since March 1; Section 301 surcharges on Chinese parts stack on top.
- Memory allocation: DRAM remains the most volatile category — contract pricing up sharply, HBM sold out through 2026.
- Korean semiconductor exports hit a record $30B/month in March.
One Thing
The buyers who treated Q1 as "still a glut" are now placing Q3 orders into a constrained market at higher prices. Position urgency is the entire game: secure allocation-risk lines before the price letters, not after.