Coatings & Paints Suppliers
Conductive coatings and EMI shielding paints — nickel, copper, and silver-based coatings for plastic enclosure shielding.
11 suppliers listed
AI Technology (AIT)
Princeton Junction, NJ, USA
Manufacturer of thermally conductive adhesives, die-attach materials, and EMI shielding compounds for semiconductor packaging and electronics assembly.
Capabilities
AJ Adhesives, Inc.
Louis, MO, USA
AJ Adhesives, Inc. is an EMI shielding and electronic components supplier.
Dow Silicones
Midland, MI, USA
Provides thermal interface materials, conductive adhesives, and encapsulants for electronics. Extensive portfolio of gap fillers, thermal pads, and potting compounds.
Capabilities
Henkel Loctite
Dusseldorf, Germany
Provides EMI shielding adhesives, conductive coatings, and thermal management materials for EV battery pack assembly and protection.
Capabilities
Master Bond, Inc.
Hackensack, NJ, USA
Master Bond, Inc. is an EMI shielding and electronic components supplier.
MG Chemicals
Burlington, ON, Canada
Provides EMI/RFI shielding paints, conductive coatings, and conformal coatings for electronics. Nickel and copper-based aerosol and brush-on shielding products.
Capabilities
Nolato AB
Torekov, Sweden
Swedish manufacturer of conductive silicone gaskets and EMI shielding solutions. Strong presence in automotive and telecom markets with form-in-place and custom profiles.
Capabilities
Parker Hannifin (Chomerics)
Woburn, MA, USA
Global leader in EMI shielding, thermal management, and specialty sealing. Chomerics division provides conductive elastomers, form-in-place gaskets, and thermal interface materials.
Capabilities
Parson Adhesives, Inc
Rochester, MI, USA
Parson Adhesives, Inc is an EMI shielding and electronic components supplier.
PPG Aerospace
Pittsburgh, PA, USA
Aerospace coatings manufacturer providing EMI/RFI shielding coatings, conductive primers, and specialty finishes for military and commercial aviation electronics.
Capabilities
Shin-Etsu Chemical
Tokyo, Japan
Major silicone manufacturer providing thermal interface materials, encapsulants, and conductive adhesives for electronics assembly and packaging.
Capabilities