Thermal Management Suppliers
Thermal interface materials, gap fillers, thermal pads, and heat sinks for electronics thermal management.
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Frequently Asked Questions
What is a thermal interface material (TIM)?
A thermal interface material fills microscopic air gaps between a heat-generating component and a heat sink or enclosure surface. Air is a poor thermal conductor (0.025 W/mK), so TIMs with thermal conductivity of 1-15 W/mK dramatically improve heat transfer. Common types include thermal greases, phase-change materials, gap pads, and thermally conductive adhesives.
When should I use a heat sink versus a gap pad?
Heat sinks are used when you need active or passive convective cooling for high-power components (typically >5W). Gap pads are used to conduct heat from a component to a nearby surface (chassis, spreader plate) when there is a physical gap to bridge. Many designs use both: a gap pad to transfer heat to a chassis that acts as a large heat sink.
What thermal conductivity do I need?
For most electronics, TIMs with 1-5 W/mK are sufficient. High-power applications like EV inverters or 5G base stations may need 5-15 W/mK materials. The total thermal resistance of the interface depends on both conductivity and thickness—a thin layer of moderate-conductivity material often outperforms a thick layer of high-conductivity material.
Are there combined thermal and EMI shielding solutions?
Yes. Thermally conductive EMI gaskets, metallized gap pads, and shielded thermal interface materials serve both functions. These combination materials are increasingly used in EV battery packs and 5G equipment where both thermal management and EMI compliance are critical in the same assembly.