Gap Fillers & Thermal Pads Suppliers

Thermal gap fillers and pads for electronics heat transfer — silicone and non-silicone gap pads, putties, and dispensable fillers.

8 suppliers listed

Boyd Corporation

Pleasanton, CA, USA

Engineered thermal management and sealing solutions. Provides heat sinks, liquid cooling, and thermal interface materials for high-performance electronics.

ISO-9001IATF-16949AS9100

Capabilities

liquid-coolingvapor-chambercustom-heat-sinksdie-cutting

Dow Silicones

Midland, MI, USA

Provides thermal interface materials, conductive adhesives, and encapsulants for electronics. Extensive portfolio of gap fillers, thermal pads, and potting compounds.

ISO-9001ISO-14001

Capabilities

custom-formulationsdispensing-solutionsthermal-testing

Fujipoly

Carteret, NJ, USA

Manufacturer of thermal interface materials including Sarcon thermal pads, gap fillers, and phase change materials. Known for ultra-soft, high-conductivity thermal pads.

ISO-9001IATF-16949

Capabilities

custom-die-cuttingthermal-padsphase-change-materials

Henkel (Bergquist)

Dusseldorf, Germany

Thermal management solutions including gap pads, phase change materials, and thermally conductive adhesives. Bergquist brand is an industry standard in TIM products.

ISO-9001IATF-16949

Capabilities

custom-formulationsdispensing-solutionsapplication-engineering

Honeywell Electronic Materials

Tempe, AZ, USA

Provides PTM-series phase change thermal interface materials and thermal pads for semiconductor packaging and power electronics thermal management.

ISO-9001

Capabilities

phase-change-materialsthermal-padscustom-formulations

Laird Performance Materials

Earth City, MO, USA

Provides EMI shielding, thermal management, and antenna solutions for advanced electronics. Expertise in board-level shields, gaskets, and absorbers for automotive and 5G applications.

ISO-9001IATF-16949ISO-14001

Capabilities

die-cuttingcustom-designthermal-simulationprototyping

Rogers Corporation

Chandler, AZ, USA

Advanced materials manufacturer providing PORON urethane foams, BISCO silicones, and curamik ceramic substrates for battery pack EMI shielding and thermal management.

ISO-9001IATF-16949ISO-14001

Capabilities

advanced-materialscustom-formulationsceramic-substrates

Shin-Etsu MicroSi

Phoenix, AZ, USA

Provides silicone-based thermal interface materials including thermal compounds, pads, and adhesives. Known for high-performance X-23 series thermal grease.

ISO-9001

Capabilities

thermal-compoundsthermal-padsdispensing-solutions